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Questions tagged [bga]

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Ball Grid Array - A type of chip packaging in which the "pins" or connections to the PCB is a series of small lands or pads which come prepared with small solder balls attached. When place upon the corresponding matching pattern on the PCB and subjected to solder reflow, the balls melt and form electrical and mechanical connections between the land on the package and the pad on the PCB. Characterized by attachment on the flat bottom of the package.

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I’m analyzing a BGA failure on a board and I'm trying to determine whether the damaged solder balls seen in X-ray come from thermal fatigue or from a more sudden electrical overstress (EOS) / ...
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To be specific about the part, it is LFE5U-45F-8BG381C in 381-FBGA. I have at least one ground plane and two power planes (one for VCCIO and one partitioned for VCC and VCCAUX). However I want to ...
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I wonder if it's OK to use serpentine routing between vias at under the BGA package. If you look at DDR0_DQ27, you can see that I using that area to perform length matching by use serpentine routing ...
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Assuming you routing a PCB were you using an IC with a BGA package. Your mission is to: Preserve the inteplane capacitance Fit decouplings capacitors (0201 or 0402) onto the BGA vias Not using blind ...
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I would like to design a soldered board-to-board interconnect for ~260 signals. I have a 20 mm x 20 mm BGA land pattern, with a ball pitch of 0.8 mm (the matrix is not full) that is normally designed ...
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I'm using Proteus 8. I want to design BGA breakout board for 0.4 mm pitch 30x30 BGA. When I want to use Via in pad, vias occupy space all the layers. If I use padstack mode it's ok to design specific ...
ozkan pc's user avatar
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Designing a board with a large 0.8mm pitch BGA and I have a large number of diff pairs to pull out. Some need to run the entire length of the part (about 800 mils) because that is the direction I need ...
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I am designing a PCB which includes a BGA connector and differential pairs. The differential signals are Displayport and Ethernet. Those tracks go connector to connector only. I choose 0.2mm drill ...
esat's user avatar
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I am working on a hobby project, trying to make a board with a STM32MP1. As a challenge I want to make it the cheapest possible with JLCPCB PCB assembly, and so I took the single core BGA-257 version, ...
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We are seeing board problems when testing a new batch of boards at high temperatures (70°C). This is using leaded solder (and OEM leaded BGA balls) and the component is rated to 100°C. We believe one ...
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Recently I bought a BGA Station to desolder and solder CPU Sockets. Unfortunately I experience issues with that. Problem: The CPU Socket won't come off. If I rise the temperature, the plastic around ...
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For BGA packages, I never see people tying power/GND pins together on BGA package (e.g. tying +1.1V_FPGA pins together as shown). Usually I see one ball to one via like how the GND is layout as shown. ...
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I need to make an interposer to sit on a QFN pads. I think i want to make small BGA-like balls over the QFN pads. How do I do it and what do I need to know?
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I have a DSBGA IC (TI TPS7A21) that measures only 0.622 x 0.622 mm. Here is the datasheet. The IC is sectioned into four quadrants. So far, so good, but: How can I identify from the top view, what pin ...
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Is there any way to properly remove Flux residue under a BGA package? Isopropanol won't work here.
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